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product structure : silicon monolithic integrated circuit this product has no designed pr otection against radioactive rays 1 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 tsz22111 ? 14 ? 001 w ww.rohm.com usb type - c power delivery controller bm92a20mwv - z general description bm92a20mwv - z is a full function usb type - c power delivery (pd) controller that supports usb power delivery using baseband communication. bm92a20mwv - z includes pd policy engine support and operates independently. in addition, this ic has the error amplifier of the secondary side for variable output pd ac adapter systems. features ? usb type - c spec ification c ompatible ? usb pd spec ification c ompatible (bmc - phy) ? two p ower p ath c ontrol using n - ch mosfet d rivers with b ack f low p revention ? type - c c able o rientation d etection ? supports dfp - source m ode ? integrated secondary side of ac - adapter system ? ec - less operation (auto mode) key specifications ? vbus voltage range: 4 .7 5 v to 2 0 v ? power consumption at sleep power: 0.4 mw (typ) ? operating temperature range: - 30 c to +10 5 c applications ? consumer applications: ac adapters, chargers package w (typ) x d(typ) x h(max) uqfn40v5050a 5.00 mm x 5 .00 mm x 1.00 mm typical application circuit datashee t BM92A20MWV-Z uqfn40v5050a vstr/atst2 gpio1 dbgmoddt dbgrstck gpio5 gpio4 smdata smclk idsel/atst1 xclpoff1 xclpoff2 dschg vb vex cc1 cc2 gnd gnd ldo15dcap ldo28cap ldo15acap gnd vccin csensep csensen xrst vddio vconn_in vsvr vccin exp-pad open (or 5 v source) gpio0 gpio6 gpio7 vddio vddio vccin usb type-c receptacle or captive cable vbus cc1 cc2 gnd s2_drv_g2 s2_drv_src s2_drv_g1 s1_drv_src s1_drv_g1 s1_drv_g2 d+ d- for bc1.2 dcp acdc primary side ifb + gpo2/vdiv gpo3/fb ifb vo vccin
2 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z contents general description ................................ ................................ ................................ ................................ ................................ ........ 1 features ................................ ................................ ................................ ................................ ................................ .......................... 1 key specifications ................................ ................................ ................................ ................................ ................................ ........... 1 applications ................................ ................................ ................................ ................................ ................................ .................... 1 package w (typ) x d(typ) x h(max) ................................ ................................ ................................ ................................ ..... 1 typical application circuit ................................ ................................ ................................ ................................ ............................... 1 contents ................................ ................................ ................................ ................................ ................................ ......................... 2 notation ................................ ................................ ................................ ................................ ................................ .......................... 3 reference ................................ ................................ ................................ ................................ ................................ ....................... 3 pin configuration ................................ ................................ ................................ ................................ ................................ ............ 4 pin descriptions ................................ ................................ ................................ ................................ ................................ .............. 5 block diagram ................................ ................................ ................................ ................................ ................................ ................ 6 absolute maximum ratings (ta=25 c) ................................ ................................ ................................ ................................ .......... 7 thermal resistance (note 3) ................................ ................................ ................................ ................................ ............................... 7 recommended operating conditions ................................ ................................ ................................ ................................ ............. 8 electrical characteristics ................................ ................................ ................................ ................................ ................................ . 8 1. internal memory cell characteristics ................................ ................................ ................................ .............................. 8 2. circuit power characteristics ................................ ................................ ................................ ................................ .......... 8 3. digital pin dc characteristics ................................ ................................ ................................ ................................ ......... 9 4. power supply management ................................ ................................ ................................ ................................ .......... 10 5. cc_phy ................................ ................................ ................................ ................................ ................................ ....... 12 6. voltage detection ................................ ................................ ................................ ................................ .......................... 14 7. vbus discharge ................................ ................................ ................................ ................................ ........................... 14 8. power fet gate driver ................................ ................................ ................................ ................................ ................. 15 9. acdc bridge ................................ ................................ ................................ ................................ ................................ 16 timing chart ................................ ................................ ................................ ................................ ................................ ................. 17 1. power on sequence ................................ ................................ ................................ ................................ ..................... 17 2. reset timing ................................ ................................ ................................ ................................ ................................ . 17 3. power off sequence ................................ ................................ ................................ ................................ ..................... 17 application example ................................ ................................ ................................ ................................ ................................ ..... 18 selection of components externally connected ................................ ................................ ................................ ........................... 18 i/o equivalence circuit ................................ ................................ ................................ ................................ ................................ . 19 operational notes ................................ ................................ ................................ ................................ ................................ ......... 23 1. reverse connection of power supply ................................ ................................ ................................ ........................... 23 2. power supply lines ................................ ................................ ................................ ................................ ...................... 23 3. gr ound voltage ................................ ................................ ................................ ................................ ............................. 23 4. ground wiring pattern ................................ ................................ ................................ ................................ .................. 23 5. recommended operating conditions ................................ ................................ ................................ ........................... 23 6. inrush current ................................ ................................ ................................ ................................ ............................... 23 7. operation under strong electromagnetic field ................................ ................................ ................................ ............. 23 8. testing on application boards ................................ ................................ ................................ ................................ ....... 23 9. inter - pin short and mounting errors ................................ ................................ ................................ .............................. 24 10. unused input pins ................................ ................................ ................................ ................................ ......................... 24 11. regarding the input pin of the ic ................................ ................................ ................................ ................................ .. 24 12. ceramic capacitor ................................ ................................ ................................ ................................ ........................ 24 13. area of safe operation (aso) ................................ ................................ ................................ ................................ ...... 24 14. over current protection circuit (ocp) ................................ ................................ ................................ .......................... 24 ordering information ................................ ................................ ................................ ................................ ................................ ..... 25 marking diagrams ................................ ................................ ................................ ................................ ................................ ......... 25 physical dimension and packing information ................................ ................................ ................................ ............................... 26 revision history ................................ ................................ ................................ ................................ ................................ ............ 27
3 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z notation category notation description unit v volt (unit of voltage) a ampere (unit of current) 2kp ohm (unit of resistance) f farad (unit of capacitance) deg., degree degree celsius (unit of t emperature) hz hertz (unit of frequency) s (lower case) second (unit of time) min minute (unit of time) b, bit bit (unit of digital data) b, b yte 1 byte = 8 bits unit prefix m, mega - , mebi - 2 20 = 1,048,576 xvhgzlwk3elwru3e\wh m, mega - , million - 10 6 = 1,000,000 xvhgzlwk3 ru3+] k, kilo - , kibi - 2 10 = 1,024 xvhgzlwk3elwru3e\wh k, kilo - 10 3 = xvhgzlwk3 ru3+] m, mi lli - 10 - 3 , micro - 10 - 6 n, nano - 10 - 9 p, pico - 10 - 12 numeric value xx h, xx h hexadecimal number. 3[dq\doskdqxphulfriwrru$wr) xx b %lqdu\qxpehu3epd\ehrplwwhg 3[dqxpehuru 3blvxvhgdvdqleeoh bit) delimiter. hj3be = 3 k address #xx h address in a hexadecimal number. 3[dq\doskdqxphulfriwrru$wr) data bit[n] n - th single bit in the multi - bit data. bit[n:m] bit range from bit[n] to bit[m]. signal level 3++ljk high level (over v ih or v oh ) of logic signal. 3//rz low level (under v il or v ol ) of logic signal. 3=3+l - = high impedance state of 3 - state signal. reference name reference document release date publisher usb type - c 386%7\sh - c specification release 3 . apr.2015 usb.org usb pd 33rzhu'holyhu\6shflilfdwlrq5hylvlrq 2.0 version 7. may.2015 usb.org smbus 36\vwhp0dqdjhphqw%xv60%xv6shflilfdwlrq9huvlrq 3. aug.2000 system management implementers forum
4 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z pin configuration (top view) s 1 _ d r v _ g 2 s 1 _ d r v _ s r c s 1 _ d r v _ g 1 v e x s 2 _ d r v _ g 2 s 2 _ d r v _ s r c s 2 _ d r v _ g 1 g p o 3 / f b v d d i o g p i o 1 g p i o 0 g p o 2 / v d i v d b g m o d d t d b g r s t c k x r s t v c c i n g n d g n d g n d v s v r d s c h g v b l d o 1 5 a c a p l d o 2 8 c a p l d o 1 5 d c a p i d s e l / a t s t 1 v s t r / a t s t 2 g p i o 5 g p i o 6 g p i o 7 s m c l k s m d a t a v c o n n _ i n c s e n s e n c s e n s e p x c l p o f f 1 x c l p o f f 2 g p i o 4 c c 2 c c 1 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 1 3 4 5 6 7 8 9 1 0 2 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 e x p - p a d
5 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z pin description s pin no. pin name i/o type digital i/o level description 1 gnd i gnd - ground 2 vstr/atst2 io analog - a nalog test /debug pin 3 idsel/atst1 i analog / digital vccin smbus id ( d evice a ddress) selection 3+$ k3 / h /debug pin 4 xrst i digital vccin digital block r eset 5 vccin o analog - internal p ower supply (need c apacitor) 6 vsvr i power - (connect to gnd ) 7 dschg io analog - discharge n - ch mosfet d rain 8 gnd i gnd - ground 9 vb i power - p ower supply from vbus 10 gpio4 i digital - mode fixation (fix: l) 11 gpio5 o digital - nc pin 12 gpio6 o digital - nc pin 13 gpio7 o digital - nc pin 14 dbgrstck io digital vddio test for logic 15 dbgmoddt io digital vddio test for logic 16 gpio0 o (note 1) dig ital vddio nc pin 17 gpio1 o (note 1) digital vddio alert signal 18 vddio i power - interface v oltage 19 smdata io digital vddio smbus d ata 20 smclk i digital vddio smbus c lock 21 s2_drv_g1 o analog - vex discharge n - ch mos fet g ate c ontrol 22 s2_drv_s rc i analog - vex discharge n - ch mos fet bg/ source 23 s2_drv_g2 o analog - (not used) 24 s1_drv_g1 o analog - power p ath n - ch mos fet g ate c ontrol 25 s1_drv_src i analog - power path n - ch mos fet bg/ source 26 s1_drv_g2 o analog - power path n - ch mos fet ga te c ontrol 27 gnd i gnd - ground 28 vex i power - e xtension p ower input 29 gpo2/vdiv o analog vccin phase compensation 30 gpo3/fb o analog vccin error amp output 31 csensen i analog vccin current s ense v oltage i nput n egative 32 csensep i analog vccin current s ense v oltage i nput p ositive 33 xclpoff1 i analog vccin disable c lamper of cc1 (fix: l) 34 xclpoff2 i analog vccin disable c lamper of cc2 (fix: l) 35 cc1 io analog - configuration c hannel 1 for type - c 36 vconn_in i analog - input power for vco nn 37 cc2 io analog - configuration channel 2 for type - c 38 ldo15dcap o analog - internal ldo 1.5 v for digital (need c apacitor) 39 ldo28cap o analog - internal ldo 2.8 v for analog (need c apacitor) 40 ldo15acap o analog - internal ldo 1.5 v for analog (need c apacitor) - e xp - pad - - - the exp - pad connect to gnd . (note 1 ) n - ch open drain
6 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z block diagram bm92a20mwv - z is usb type - c pd controller for ac adapter applications that supports type - c dfp port control and usb power delivery using baseband communication. it is compatible with usb type - c specification and usb power delivery specification. and it has acdc bridge which is constructed in error amplifier (for fly - back ac adapter system) and current sense (for var iable ocp function). bm92a20mwv - z includes the following functional blocks: type - c physical layer (baseband phy), bmc encoder/decoder, usb pd protocol engine, a n - ch mosfet switch driver, ovp and discharge fet. bm92a20mwv - z includes an eeprom, enabling code updates via the smbus interface during prototyping phase. t y p e - c p h y s i c a l l a y e r p r o t o c o l b a s e b a n d p d p h y s i c a l l a y e r s m b u s n - c h m o s f e t s w i t c h g a t e d r i v e r u s b t y p e - c p o w e r d e l i v e r y s p i i / f e e p r o m s 1 _ d r v _ g 2 s 1 _ d r v _ s r c s 1 _ d r v _ g 1 v e x s 2 _ d r v _ g 2 s 2 _ d r v _ s r c s 2 _ d r v _ g 1 g p o 3 / f b v d d i o g p i o 1 g p i o 0 g p o 2 / v d i v d b g m o d d t d b g r s t c k x r s t v c c i n g n d g n d g n d v s v r d s c h g v b l d o 1 5 a c a p l d o 2 8 c a p l d o 1 5 d c a p i d s e l / a t s t 1 v s t r / a t s t 2 g p i o 5 g p i o 6 g p i o 7 s m c l k s m d a t a v c o n n _ i n c s e n s e n c s e n s e p x c l p o f f 1 x c l p o f f 2 g p i o 4 c c 2 c c 1 d e v i c e p o l i c y m a n a g e r a c d c b r i d g e
7 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z absolute maximum ratings (t a =25 c) parameter symbol rating unit conditions maximum supply voltage1 (v b, vex, dschg, s2_drv_g1, s2_drv_g2, s2_drv_src, s1_drv_g1, s1_drv_src, s1_drv_g2 ) v in1 - 0.3 to +28 v (note 2) maximum supply voltage2 (vddio, vsvr, dbgrstck, dbgmoddt, gpio0, gpio1, smdata, smclk, xrst, vconn_in, vstr/atst2, idsel/atst1, vccin, gpio 4, gpio5, gpio6, gpio7, gpo2/vdiv, gpo3/fb, csensen, csensep, xclpoff1, xclpoff2, cc1, cc2, ldo28cap ) v in2 - 0.3 to +6. 5 v - maximum supply voltage3 (ldo15dcap, ldo15acap) v in3 - 0.3 to +2.1 v - maximum d ifferent voltage (s2_drv_g1 - s2_drv_src, s2_drv _g2 - s2_drv_src, s1_drv_g1 - s1_drv_src, s1_drv_g2 - s1_drv_src) v diff - 0.3 to +6.5 v - maximum junction temperature tjmax 150 c - storage temperature range tstg - 55 to +125 c - caution 1 : operating the ic over the absolute maximum ratings may dam age the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the abs olute maximum ratings. caution 2 : should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in de terioration of the properties of the chip. in case of exceeding this absolute maximum rating, de sign a pcb boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (note 2) t he dschg pin connects more than n for current limiting. thermal resista nce ( note 3 ) parameter symbol thermal resistance (typ) unit 1s (note 5 ) 2s2p ( note 6 ) uqfn40v5050a junction to ambient ja 125.0 43.0 c/w junction to top characterization parameter (note 4 ) jt 21 14 c/w (note 3 ) based on jesd51 - 2a(still - air) . (not e 4 ) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top c enter of the outside surface of the component package. (note 5 ) using a pcb board based on jesd51 - 3. layer number of measureme nt board material board size single fr - 4 114.3 mm x 76.2 mm x 1.57 mmt top copper pattern thickness footprints and traces 70 m (note 6 ) using a pcb board based on jesd51 - 5, 7. layer number of measurement board material board size thermal via (note 7 ) pitch diameter 4 layers fr - 4 114.3 mm x 76.2 mm x 1.6 mmt 1.20 mm - mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2 mm x 74.2 mm 35 m 74.2 mm x 74.2 mm 70 m (note 7 ) this thermal via connects with the copper pattern of all layers.
8 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z recommended operating conditions item symbol limit unit conditions min typ max vb, vex voltage v b , v ex 4.75 - 20 v usb vbus voltage vsvr voltage v svr 3.1 - 5.5 v connect to gnd vddio voltage v ddio 1.7 - 5.5 v connect to vccin vconn_in input voltage v conn 4.75 5.0 5.5 v - operating temperature topr - 30 + 25 +105 c - electrical characteristics 1. internal memory cell characteristics (v b = v ex =4.7 5 v to 2 0 v , v sv r = 0 v ) item limit unit conditions min typ max data r ewriting n umber (note 8 ) 1000 - - time ta ? 25 c 100 - - time ta ? 105 c data r etention l ife (note 8 ) 20 - - year ta ? 25 c 10 - - year ta ? 105 c caution : customer is permitted to rewrite eeprom on bm92a20mwv - z only in case of being provided technical support from rohm. (note 8 ) not 100% tested . 2. circuit power characteristics (ta=25 c , v svr = 0 v, v ddio = vccin , vex=5 v, v b = o pen ) item limit unit conditions mi n typ max sleep p ower - 0. 9 - mw (note 9 ) standby p ower - 6 - mw (note1 0 ) (note 9 ) sleep power: power consumption at unattached plug. (note 1 0 ) standby power: power consumption at attached plug.
9 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z electrical characteristics - continued 3. digital pin dc characteristics (ta=25 c , v svr = v ddio = 3.3 v , v ccin =v svr , v b = v ex = o pen ) item symbol limit unit comment min typ max vddio power pin : gpio0, gpio1, smdata, smclk input "h" l evel v ih1 0.8 v ddio - v ddio + 0.3 v - input "l" l evel v il1 - 0.3 - 0.2 v ddio v - input l eak c urrent i ic1 - 5 0 + 5 a power: vddio 2xwsxw9rowdjhzkhq3+ v oh1 0.7 v ddio - - v source =1 ma smdata p in "l" l evel v oltage (smdata) v ol _ smdata - - 0.4 v sink =350 a max . 2xwsxw9rowdjhzkhq3/ (gpio0, gpio1) v ol1 - - 0.3 v sink =1 ma vccin power pin : xrs t, gpo2, gp o3, gpio4, gpio5, gpio6, gpio7 input "h" l evel v ih2 0.8 v ccin - v ccin + 0.3 v - input "l" l evel v il2 - 0.3 - 0.2 v ccin v - input l eak c urrent i ic2 - 5 0 + 5 a power: vccin 2xwsxw9rowdjhzkhq3+ (gpio s ) v oh2 0.7 v ccin - - v source =1 ma 2xwsxw9rowdjhzkhq3/ (gpio s ) v ol2 - - 0.3 v sink =1 ma
10 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z electrical characteristics - continued 4. power supply management bm92a20mwv - z has a power selector. it select s the lowest power supply volta ge from the vsvr, vex or vb pin s for low power consumption. internal power supply ( the vccin pin ) gives priority in order of the vsvr, vex and vb pin s . t he vccin pin supplied from the power selector is used to bm92a20m wv - z main power source. ldos (for internal only) are supplied from the vccin pin , and output each internal supply voltage. each power supply input ha s uvlo and ovlo . and por (power on reset) signal is generated from detection of ldo28ok, ldo15dok and ldo 15aok signals , and the vccin pin . p o w e r s e l e c t o r w i t h r e g u l a t o r v s v r v e x v b v c c i n u v l o / o v l o d e t e c t i o n i n t e r n a l p o w e r s u p p l y v c c i n p o r ( 2 . 6 v ) p o r s i g n a l l d o ( 2 . 8 v ) l d o ( 1 . 5 v ) l d o ( 1 . 5 v ) l d o 2 8 c a p l d o 1 5 d c a p l d o 1 5 a c a p l d o 2 8 o k l d o 1 5 d o k l d o 1 5 a o k i n t e r n a l p o w e r s u p p l y u v l o / o v l o s i g n a l v d d i o v d d i o d e t e c t i o n s i g n a l d e t v b u s v e x v s v r v c c i n 0 v 5 v t o 2 0 v 0 v 5 v t o 2 0 v 0 v 5 v 0 v v b u s v e x v s v r
11 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z 4. power supply management - continued item limit unit comment min typ max unless otherwise specified ta=25 c , v gnd = 0 v , c vccin = 4.7 f (ceramic) , c ldo 28 =c ldo15d =c ldo15a = 1 f (ceramic) input analog pins: vsvr, vex, vb uvlo r ising t hreshold v oltage 1 - 2.8 - v vsvr uvlo r ising t hreshold v oltage 2 - 3.5 - v vex, vb uvlo f alling t hreshold v oltage - 2.7 - v vsvr, vex, vb ovlo r ising t hreshold v oltage - 6 .4 - v vsvr ovlo r ising t hreshold v oltage - 28 - v vex, vb ovlo h ysteresis v oltage 1 - 240 - mv vsvr ovlo h ysteresis v oltage 2 - 920 - mv vex, vb power on r eset t hreshold v oltage - 2.6 - v vccin vddio d etection v oltage 1.7 - - v for d ead b attery o pera tion ldo28cap o utput v oltage - 2.8 - v no load, v ex = 5 v ldo15dcap o utput v oltage - 1.5 - v no load, v ex = 5 v ldo15acap o utput v oltage - 1.5 - v no load, v ex = 5 v
12 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z electrical characteristics - continued 5. cc_phy cc_phy has below functions of usb type - c ( refer to usb type - c specification ) : defining port mode : dfp dfp - to - ufp attach / detach detection plug orientation / cable twist detection usb type - c vbus voltage detection and usage 9&2116xsso\iru623?&rqwuro base b and power delivery communication (bbpd c o mmunication) port_cont this block is fixed dfp mode . dfp mode: variable current source is connected to the cc 1 and cc2 pin . these currents of each mode are default current, medium current and high current. cc_det cc_de 7kdvixqfwlrqvri3$wwdfk / 'hwdfk'hwhfwlrq33oxj2ulhqwdwlrq / &deoh7zlvw'hwhfwlrq3'lvfryhu\dqgghwhfw h[whqvlrqprghdqg386%7\sh - &9%86&xuuhqw'hwhfwlrq attach / detach is detected with monitoring voltage of the cc 1 and cc2 pin . when the volta ge of the cc 1 and cc2 pin become under a threshold voltage at dfp, attach is detected. oppositely, when the voltage of the cc 1 and cc2 pin become over a threshold voltage, detach is detected. when the voltage of the cc 1 and cc2 pin become over a threshold voltage at ufp, attach is detected. c c 1 c c 2 c c _ d e t b b _ p h y v c o n n _ i n c o n t r o l l o g i c g n d g n d m c u r e c e p t a c l e r d r d p o r t _ c o n t u f p _ c l a m p v b u s _ m o n i v b u s m c u x c l p o f f
13 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z 5. cc_phy - continued plug orientation and cable twist is detected from the relationship of the cc 1 and cc2 pin s . ufp can detect the maximum current of the power source by monitoring the voltage of the cc 1 and cc2 pin . vbus_moni ufp detect attach / detach by existence of vbus voltage. vbusdet detects attach when vbus voltage over the threshold voltage. and it detects detach when vbus under the threshold voltage. vconnsw vconnsw is the power switch for vconn source. it has ocp function. bb_phy if type - c controller supports bbpd, the cc 1 and cc2 pin can output bbpd communication signal. item limit unit comment min typ max [port_cont c haracteristics] u nless otherwise specified ta=25 c , v ex = 5 v, v conn_in = open , v ddio = vccin , v gnd = 0 v , c vccin = 4.7 f (ceramic), c ldo28 =c ldo15d =c ldo15a = 1 f (ceramic) input analog pins: cc1, cc2 default c urrent 64 80 96 a - medium c urrent 166 180 194 a - high c urrent 304 330 356 a - pull d own r esistor 4.6 5.1 5.6 n - [vbus _ moni] u nless otherwise specified ta=25 c , v ex = 5 v, v conn_in = open , v ddio = vccin , v gnd = 0 v , c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a = 1 f(ceramic) input analog pin: vb vbus p resence d etection l evel - 3.42 - v - [vconnsw] u nless otherwise specified ta =25 c, v ex = 5 v, v conn_in = 5 v , v ddio = vccin , v gnd = 0 v , c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a = 1 f(ceramic) input analog pins: cc1, cc2, vconn_in vconn_in to ccx r esistance - - 500 p - overcurrent p rotection l evel 1.1 - - a -
14 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z electrical characteristics - continued 6. voltage detection vdet block detects the voltage level of vb . it can detect follow conditions : ovp ( o ver v oltage p ro tection) d etection vb us v oltage d rop d etection item limit unit comment min typ max u nless otherwise specified ta=25 c , v ex = 5 v, v conn_in = 5 v , v ddio = vccin , v gnd = 0 v , c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a =1 f(ceramic) input analog pin: vb over v oltage p r otection d etection r ate + 1 5 + 20 + 2 5 % (note 11 ) vbus v oltage d rop d etection r ate - 30 - 25 - 2 0 % (note 11 ) (note 1 1 ) reference value is usb pd negotiation voltage. 7. vbus discharge fet switch is prepared for vbus discharging. item limit unit comment min typ max u nless otherwise specified ta=25 c , v ex = 5 v, v conn_in = 5 v , v ddio = vccin , v gnd = 0 v , c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a = 1 f(ceramic) input analog pin: dschg fet switch on resistance - 25 - - v b u s ( v b ) v a r i a b l e r e f e r e n c e v o l t a g e o v p d e t e c t i o n v b u s v o l t a g e d r o p d e t e c t i o n d i s c h a r g e c o n t r o l d i s c h a r g e r e s i s t o r d s c h g g n d
15 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z el ectrical characteristics - continued 8. power fet gate driver fet gate driver is the e xternal n - ch mos fet switch driver for power line switch. item limit unit comment min typ max u nless otherwise specified ta=25 c, v ex = 5 v, v conn_in = 5 v , v ddio = vccin , v gnd = 0 v , c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a = 1 f(ceramic) input analog pins: s1_drv_src = s2_drv_src = 0 v output analog pins: s1_drv_g1, s1_drv_g2, s2_drv_g1, s2_drv_g2 n - ch mos fet c ontrol v oltage b etween g ate and s ource - 6.0 - v s1_drv_g1 - s1_drv_src s1_drv_g2 - s1_drv_src s2_drv_g1 - s2_drv_src s2_drv_g2 - s2_drv_src s o u r c e p a t h s 2 _ d r v _ g 1 s 2 _ d r v _ s r c s 2 _ d r v _ g 2 s 1 _ d r v _ g 1 s 1 _ d r v _ s r c s 1 _ d r v _ g 2 c h a r g e p u m p c h a r g e p u m p c h a r g e p u m p c h a r g e p u m p i n i n o u t o u t i n i n o u t o u t v b u s v e x d i s c h a r g e
16 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z electrical characteristics - continued 9. acdc bridge acdc bridge block has an error amplifier and current sensing comparator. item limit unit comment min typ max u nless otherwise specified ta=25 c, v ex = 5 v, v conn_in =v ddio = vccin , v gnd =0 v, c vccin =4.7 f(ceramic), c ldo28 =c ldo15d =c ldo15a =1 f(ceramic) input analog pin: fb, vdiv pdo v oltage s etting r an ge 5 - 20 v - pdo v oltage s etting s tep - 50 - mv - feedback c urrent t hreshold v oltage ( note 1 2) - 2% - +2 % vex = rise trans c onductance - 1 - s d i fb /d v ex maximum f eedback c urrent 2 - - ma - pdo c urrent s etting r ange 0 - 5 a - pdo c urrent s etting s tep - 10 - ma - current s ense d etecting (ocp) r ate ( note 12 ) - 120 - % - (note 1 2 ) reference value is usb pd negotiation voltage and current . the minimum ocp setting is 1.2 a. + s g n d + - v c c i n v b o c p ( v a r i a b l e ) g p o 3 / f b g p o 2 / v d i v c s e n s e p c s e n s e n v e x i f b v e x
17 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z timing chart 1. power on sequenc e 2. reset timing item symbol limit unit comment min typ max xrst minimum 3 l level pulse t 1 100 - - s - smbus a ccess start a fter xrst r elease t 2 230 - - ms - 3. power off sequence v s v r v e x 0 v 0 v 5 v ( s t a t u s ) f i r m w a r e d o w n l o a d ( m a x 2 3 0 m s ) f i r m w a r e d o w n l o a d n o r m a l o p e r a t i o n s h u t d o w n x r s t t 1 t 2 i n p u t v e x 0 v ( s t a t u s ) n o r m a l o p e r a t i o n 4 . 7 5 v t o 2 0 v s h u t d o w n
18 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z application exam ple selection of components externally connected item symbol limit unit comment min typ max vccin capacitance (note 13) c vccin 0.60 4.7 10 f - ldo15acap capacitance (note 13) c ldo15a 0.47 1.0 2.2 f - ldo15dcap capa citance (note 13) c ldo15d 0.47 1.0 2.2 f - ldo28cap capacitance (note 13) c ldo28 0.47 1.0 2.2 f - q 1 , q 2 gate - source capacitance c qx_gs 470 p - 0.5 f - acdc system phase compensation capacitance (note 1 4 ) c 1 - - - f please choose the value suitable for acdc system. c 2 - - - f phase compensation capacitance (note 13) c 4 470 p - 0.5 f in the case of not r 2 =0 , c 4 is this range. c 3 + c 4 + c qx_gs 470 p - 0.5 f in the case of r 2 =0 , c 3 +c 4 +c qx_gs is this range. resistance for the vbus s lew rate setting r 2 - - - please choose the value suitable for acdc system. capacitance for the vbus s lew rate setting (note 1 4 ) c 3 - - - f current sensing resistor for ocp r cs - 10 - m - acdc system phase compensation resistance r 1 - - - please choose the value suitable for acdc system. acdc feedback current limit resistor r 3 - - - k (note 1 3 ) use the ceramic capaci tor which capacitance value to decrease by temperature characteristics and dc bias is larger than the minimum limit. (note 1 4 ) use the ceramic capacitor. b m 9 2 a 2 0 m w v - z u q f n 4 0 v 5 0 5 0 a v s t r / a t s t 2 g p i o 1 d b g m o d d t d b g r s t c k g p i o 5 g p i o 4 s m d a t a s m c l k i d s e l / a t s t 1 x c l p o f f 1 x c l p o f f 2 d s c h g v b v e x c c 1 c c 2 g n d g n d l d o 1 5 d c a p l d o 2 8 c a p l d o 1 5 a c a p g n d v c c i n c s e n s e p c s e n s e n x r s t v d d i o g n d v c o n n _ i n v s v r v c c i n e x p - p a d o p e n ( o r 5 v s o u r c e ) g p i o 0 g p i o 6 g p i o 7 v d d i o v d d i o v c c i n u s b t y p e - c r e c e p t a c l e o r c a p t i v e c a b l e v b u s c c 1 c c 2 g n d s 2 _ d r v _ g 2 s 2 _ d r v _ s r c s 2 _ d r v _ g 1 s 1 _ d r v _ s r c s 1 _ d r v _ g 1 s 1 _ d r v _ g 2 1 0 k 1 0 k 1 0 0 k 1 0 0 k 1 0 0 k 1 f 0 . 0 1 f 1 k 1 f 0 . 0 1 f 1 0 0 k 1 0 0 k 1 0 0 k 1 0 0 k 1 0 0 k 1 0 0 k c v c c i n c l d o 1 5 d c l d o 2 8 c l d o 1 5 a r c s 1 0 f q 1 q 2 s g n d s g n d s g n d s g n d s g n d s g n d c 4 r 2 r 2 c 4 s g n d d + d - f o r b c 1 . 2 d c p a c d c p r i m a r y s i d e i f b r 3 c 1 c 2 r 1 s g n d + g n d 1 2 0 g p o 2 / v d i v g p o 3 / f b i f b s g n d v o v c c i n c 3 c 3 s g n d
19 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z i/o equivalence circuit pin no. pin name equivalent circuit diagram 1 5 6 8 9 27 28 gnd vccin vsvr gnd vb gnd vex 7 dschg 10 11 12 13 gpio4 gpio5 gpio6 gpio7 14 15 16 17 dbgrstck dbgmoddt gpio0 g pio1 v c c i n v c c i n v c c i n v d d i o v d d i o v d d i o i n t e r n a l c i r c u i t v b v e x v s v r v c c i n p o w e r s e l e c t o r g n d g n d g n d
20 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z i/o equivalence circui t - continued pin no. pin name equivalent circuit diagram 29 gpo2 / vdiv 30 gpo3 / fb 3 1 3 2 csense n csense p 18 19 20 vddio smdata smclk 21 22 23 24 25 26 s2_drv_g1 s2_drv_src s2_drv_g2 s1_drv_g1 s1_drv_src s1_drv_g2 v c c i n v c c i n v c c i n v c c i n v c c i n v c c i n v c c i n v d d i o s m d a t a s m c l k s x _ d r v _ g 1 s x _ d r v _ g 2 s x _ d r v _ s r c
21 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z i/o equivalence circuit - continued pin no. pin name equivalent circuit diagram 33 34 35 36 37 xclpoff1 xclpoff2 cc1 vconn_in cc2 4 xrst 38 40 ldo15dcap ldo15acap 39 ldo28cap c c 2 v c o n n _ i n x c l p o f f 2 c c 1 x c l p o f f 1 v c c i n v c c i n i n t e r n a l c i r c u i t v c c i n v c c i n i n t e r n a l c i r c u i t v c c i n
22 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z i/o equivalence circuit - continued pin no. pin name equivalent circuit diagram 2 vstr/atst2 3 idsel/atst1 v c c i n v c c i n
23 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polar ity when frqqhfwlqj wkh srzhu vxsso\ vxfk dv prxqwlqj dq h[whuqdo glrgh ehwzhhq wkh srzhu vxsso\ dqg wkh ,&?v srzhu supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small - signal and large - current grou nd traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of e xternal components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. recommended operating conditions the function and operation of the ic are guaranteed within the range speci fied by the recommended operating conditions. the characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, giv e special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to ma lfunction. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vs ower supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and s torage.
24 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z operational notes - continued 9. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. rega rding the input pin of the ic this ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasi tic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided . 12. ceramic capacitor when using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and the maximum junction temperature rating are all within the area of safe operation (aso). 14. over current protection circuit (ocp) this ic incorpo rates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterize d by continuous operation or transitioning of the protection circuit. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
25 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z ordering information b m 9 2 a 2 0 m w v - z e2 part number package mwv:uqfn40v5050a manufacturing code packaging and formi ng specification e2: embossed tape and reel marking diagrams uqfn40v5050 a (top view) m 9 2 a 2 0 part number marking lot number pin 1 mark
26 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z physical dimension and packing information package name uqfn40v5050 a
27 / 27 tsz02201 - 0232aa000650 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 19.jan.2018 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bm92a20mwv - z revision history date revision changes 21.sep.2016 001 new release 06.mar.2017 002 (1) p age 1, 4, 2 4 title nam e changed (2) p age 2 7 ordering information changed 19 . jan .201 8 003 (1) datasheet format update (2) correct errors of the vbus detection rate
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipment (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (n ote1) m edical equipment c lassification of the s pecific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount products , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pr od ucts, you are requested to caref ully read this document and fully understand its contents. rohm shall n o t be in an y way responsible or liable for fai lure, malfunction or accid ent arising from the use of an y rohms products against warning, caution or note contained in this document. 2. all information contained in this docum en t is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohms products, please confirm the la t est information with a rohm sales representative. 3. the information contained in this doc u ment is provid ed on an as is basis and rohm d oes not warrant that all information contained in this document is accurate an d /or error-free. rohm shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur a cy or errors of or concerning such information.
datasheet part number bm92a20mwv package uqfn40v5050a unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bm92a20mwv - web page distribution inventory

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